CMP, Senior Engineering Manager

Arizona

Relocation Assistance Available

At Company in Arizona, brilliance can ignite a world of innovation and launch a promising future. The world’s most brilliant innovators entrust us to transform their ideas into world-changing products that impact millions of lives. If you have the same passion for pursuing excellence, you will find your fit here.

We are seeking a CMP Sr. Engineering Manager to join our nanometer fab, located in sunny Phoenix, Arizona. As a CMP Module Engineering Manager, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation, and Customer Trust.

The CMP Department is responsible for leading new technology transfers, new production line setup and maintenance, and quality and productivity improvement to ensure a smooth production operation.

Responsibilities:

·      Elevate engineering and manufacturing excellence in the Chemical Mechanical Polishing department

·      Module process and equipment fundamental improvements

·      Innovate and seize opportunities for wafer quality and productivity improvement

·      Work with Process integration, Manufacturing, Yield improvement, and Cross-Module team to sustain high-quality wafer production and delivery

·      Proactively identify talent and continuously develop team members with a deliberate road map

·      Sustain ownership of day-to-day operations

·      Equipment troubleshooting

·      Resource planning, task prioritization, and related cross-function management work.

Minimum Qualifications:

Applicants must be legally eligible to work in the United States (US Citizen or Green Card) and have:

·      Bachelor, Master or Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering, or related field

·      6+ years of experience in the semiconductor field, especially in module process development

·      Experience in the semiconductor industry with AMAT or Ebara CMP 300mm tool process and equipment knowledge

·      Solid technical understanding of IC processing equipment, integrated flow, chemistry, and physics

·      Exhibit good and open communication skills, ability to work within cross-functional teams, including internal and external partners

·      Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles

·      Flexibility to change priorities and responsibilities to support business needs

·      Hands-on participant with a strong sense of ownership

·      Willing to work in a clean room environment

·      Polished presentation and interpersonal skills

·      Good communication and negotiation skills

·      Quick assimilation to new technology

***Must be willing to relocate to Taiwan for a 9-month period for training (major expenses paid)