JOB DESCRIPTION

SMT PROCESS ENGINEER

SUMMARY

Develop and manage SMT assembly and soldering processes and associated staff in medium volume/high-mix printed circuit board assembly operation for complex quality class 2/3 assemblies.

DUTIES AND RESPONSIBILITIES

• Plan and develop processes and capacity utilization strategy for SMT assembly operation. (Kitting, solder paste printing, automated solder paste inspection, component placement, reflow soldering, automated optical inspection, automated X-ray inspection, 2D, 3D and 5D.)
• Identify and solve production/quality issues.
• Ensure production readiness of key processes in PCB assembly cycle.
• Design experiments to develop optimum production processes. (Solder paste selection, stencil designs, feeder set up methodology, selective soldering techniques, etc.)
• Optimize machine set up and programming sequences.
• Trouble-shoot to root-cause equipment and process related problems.
• Write pre and post build DFM reports in customer centric manner.
• Manipulate data files to accomplish above (Gerber, OB++, various CAD packages and 3D modeling; i.e. Solidworks.)
• Develop appropriate secondary manufacturing processing processes: rework process, hot air, BGA repair.
• Monitor and manage PCA cleaning processes.
• Able to interpret assembly and fab drawings and the requirements within.
• Able to work directly with customer’s engineering group to improve designs and enhance processes.

REQUIREMENTS

• High School Education and Associates Degree (B.S. in related Engineering/Technical field a definite plus.)
• Highly effective and organized communication skills (Proficient in Microsoft Office Suite.)
• Prior on-the-job experience of at least 5 years in same or similar industry.
• Demonstrated positive Customer Service demeanor.